Surface-mount type emitting diode and method of manufacturing same

摘要

Disclosed herein is a surface-mount type light emitting diode wherein a reflection frame is placed around a light emitting diode element mounted on an upper surface of a glass epoxy substrate, a first resin encapsulator mixed with a wavelength-converting material is charged into the reflection frame to seal the light emitting diode element, a second resin encapsulator and a third resin encapsulator used as a surface layer are stacked on an upper portion of the glass epoxy substrate including the reflection frame in layer form to seal the entirety of the first resin encapsulator, and an ultraviolet absorbent is mixed into at least a third resin encapsulator. A wavelength-converting material such as a luminescent material or the like becomes hard to be affected by externally-incoming ultraviolet radiation or the like, whereby the aging of the wavelength-converting material can be controlled.