| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device capable of performing accurate and excellent bonding while damaging a TAB component and a glass substrate less. SOLUTION: This bonding device is provided with a press fitting block 18 for pressurizing the TAB component to the wiring pattern of the glass substrate through an anisotropic conductive film and heating it, a cylinder 17 for a low pressure for holding the press fitting block 18 and pressurizing the press fitting block 18 by a prescribed bonding pressure P at all times, and a cylinder 14 for a high pressure capable of vertically driving the cylinder 17 for the low pressure by a pressure F higher than the bonding pressure P.
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