| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment system for evenly heat treating among a plurality of wafers. SOLUTION: The heat treatment system 1 comprises a wafer boat 4 for horizontally holding a plurality of wafers and a heater in which the wafer boat 4 is arranged. The heater 3 has a plurality of main heaters 13a to 13e vertically arranged and auxiliary heaters 14a to 14e and 15a to 15e arranged in an adjacent area of the main heater arranged side by side.
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