| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin board and a package of a semiconductor which are reduced in cost and size, and improved in surface mountability, stability in high temperature, chemical resistance, adhesiveness and safety sanitation when manufactured, and a method for manufacturing them. SOLUTION: A surface part of a resin molding, especially a thermosetting resin molding formed as a plane or a container shape is roughened by a plurality of craters chained densely in a line. A metal plating film forming a printed circuit is formed in a roughened area. A resin molding with the metal plating film forming the printed circuit has the container shape, the tabular shape or a shape of various mechanical components, etc.</p> |
