SEMICONDUCTOR LASER DEVICE

摘要

PROBLEM TO BE SOLVED: To improve a semiconductor laser device in heat dissipating properties and strength. SOLUTION: A semiconductor laser device 1 is equipped with a semiconductor laser element 4, a frame 6 on which the element 4 is disposed, and a resin 5 coming into close contact with the frame 6. The frame 6 is equipped with a thick-walled part 6e and a thin-walled part 6f, and the thick-walled part 6e is formed to extend in the widthwise direction of the resin 5 as long as the width of the resin 5.