| 摘要 |
PROBLEM TO BE SOLVED: To automatically supply liquid adhesive on a transferring board and automatically remove unnecessary liquid adhesive from the transcription board in a liquid transferring device with the transcription board to keep the liquid adhesive to transfer the liquid adhesive required for flip chip mounting into a bump of a semiconductor device. SOLUTION: In the liquid transferring device to transfer a liquid adhesive 2 into a bump by being equipped with a transferring board 1 to keep the liquid adhesive 2 at a predetermined thickness and by immersing a bump of a semiconductor in the liquid adhesive 2 kept on this transferring board 1, feeding mechanisms 3, 4 supplying the liquid adhesive 2 on the transferring board 1 as well as uniformizing the supplied adhesive 2 at the predetermined thickness on the transferring board 1, and removing mechanisms 5, 6 for removing the liquid adhesive 2 kept on the transferring board 1 from the transferring board 1, are provided in the present invention.
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