发明名称 METHOD AND DEVICE FOR PREDICTING DAMAGE OF WIRING STRUCTURE HAVING PROTECTIVE FILM ON SURFACE
摘要 PROBLEM TO BE SOLVED: To enable the high-accuracy forecast, which is adaped to meet the actual wiring structure and is intended for a wiring having a protective film, for a disconnection and to enable the forrecast for a breakage of the protective film for covering the wiring. SOLUTION: The damage predicting method of a wiring structure having a protective film on the surface of a metal wiring layer has a step (S204) for finding the current density and temperature distribution of the metal wiring layer by a two-dimensional finite element analysis, steps (S206 to S210) for finding dividedly an atom flow velocity divergence in each element to divide the subject of evaluation into a void formation contribution component and a hillock formation contribution component by the found current density and temperature distribution, and atom concentration distribution and moreover, the constant of the physical properties of the material for a wiring and the internal stress of the wiring, and steps (S212 to S214) for finding a change in the atom concentration in each element by the found atom flow velocity devergence in each element. By repeating (S216 to S226) each step, the place of a fault in a short-circuit or disconnection and the time to take to the fault are predicted.
申请公布号 JP2002043316(A) 申请公布日期 2002.02.08
申请号 JP20000227023 申请日期 2000.07.27
申请人 JAPAN SCIENCE & TECHNOLOGY CORP 发明人 SASAGAWA KAZUHIKO
分类号 G01R31/02;G01R31/08;H01L21/00;H01L21/3205;H01L23/52;H01L29/00;H05K3/00;H05K3/28;(IPC1-7):H01L21/320 主分类号 G01R31/02
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