发明名称 |
ELIMINATING METHOD OF RESIDUAL MATERIALS DEPOSITED ON SUBSTRATE BY SOLDER WITH ROSIN FLUX |
摘要 |
PROBLEM TO BE SOLVED: To effectively eliminate residual materials, disposed on a substrate by solder using rosin flux on the substrate, from the substrate with organic solvent without leaving a layer formed by materials consisting of organic solvent to be used, without mechanically deteriorating the substrate and needless to say without destroying global environment. SOLUTION: An organic solvent, consisting of ketone or alcohol which don't include halogen and detergent, is sprayed on the substrate through a nozzle in the air.
|
申请公布号 |
JP2002043728(A) |
申请公布日期 |
2002.02.08 |
申请号 |
JP20000227582 |
申请日期 |
2000.07.24 |
申请人 |
NIPPON TELEGR & TELEPH CORP <NTT> |
发明人 |
MADA YOICHI;AOYAMA SHINJI |
分类号 |
B08B3/02;B08B3/08;C11D7/26;C11D7/50;H05K3/34;(IPC1-7):H05K3/34 |
主分类号 |
B08B3/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|