发明名称 ELIMINATING METHOD OF RESIDUAL MATERIALS DEPOSITED ON SUBSTRATE BY SOLDER WITH ROSIN FLUX
摘要 PROBLEM TO BE SOLVED: To effectively eliminate residual materials, disposed on a substrate by solder using rosin flux on the substrate, from the substrate with organic solvent without leaving a layer formed by materials consisting of organic solvent to be used, without mechanically deteriorating the substrate and needless to say without destroying global environment. SOLUTION: An organic solvent, consisting of ketone or alcohol which don't include halogen and detergent, is sprayed on the substrate through a nozzle in the air.
申请公布号 JP2002043728(A) 申请公布日期 2002.02.08
申请号 JP20000227582 申请日期 2000.07.24
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 MADA YOICHI;AOYAMA SHINJI
分类号 B08B3/02;B08B3/08;C11D7/26;C11D7/50;H05K3/34;(IPC1-7):H05K3/34 主分类号 B08B3/02
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