| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device which is improved in heat dissipating properties, strength, and bottom evenness. SOLUTION: A semiconductor laser device 1 is composed of a semiconductor laser element 4, a frame 6 equipped with an element arranging part 6a on which the element 4 is arranged and a lead part 6, and a resin 5 coming into close contact with the frame 6. The frame 6 is equipped with the parts 6a and 6b different from each other in thickness and a stepped part 9 on its rear surface. The resin 5 is provided with a prescribed support flat 5d on its rear surface by covering a part of the frame 6 besides the stepped part 9, and the support flat 5d is larger in area than the element arranging part 6a.
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