| 摘要 |
PROBLEM TO BE SOLVED: To solve various problems, for example, that, since the structure of a feeder for resin-sealing an IC frame is complicated, work efficiency is low and many defective products are produced on molding; since a transport time is long between carrying-out and housing devices after resin-sealing, time loss is large; and, since taking out, preheating and inputting into a mold of a sealing resin, cleaning a mold, etc., are manually performed, work efficiency is low and product quality varies. SOLUTION: A feeder carries IC frames in units of two from a housing case into a transporting table, and a conveyer for loading the IC frames in a mold is provided with a loading confirmation function. In carrying-out and housing devices, a frame placing table for receiving the IC frames separated from a runner is provided with a window. A resin-sealing device is constituted by a sealing resin case having a feeder for feeding in units of one, a preheating device and a multishaft robot for taking out, preheating and loading in a mold of the sealing resin.
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