MATERIAL FOR ELECTRONIC PARTS, METHOD FOR CONNECTING ELECTRONIC PARTS, BALL GRID ARRAY TYPE ELECTRONIC PARTS, AND METHOD FOR CONNECTING BALL GRID ARRAY TYPE ELECTRONIC PARTS

摘要

PURPOSE: To provide a material for electronic parts in which the wettability of soldering is satisfactorily be secured, further, the damage of solderability and appearance is prevented, and moreover, the generation of whiskers can be prevented. CONSTITUTION: This material for electronic parts has a plating A layer provided on a metallic material as a base material, and in which a metal X and a metal Y are coexistent and a coating B layer provided on the plating A layer and composed of the metal X.