| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device sheet separating jig for releasing many device sheets at once without damaging the sheets. SOLUTION: A plurality of sheet holding chambers C corresponding to the positions of device sheets on a wafer W surface are provided on a base board 1. Each chamber C is sectioned with partitions 41, 42 and opened above to receive the device sheet peeled down off the wafer W surface. The wafer W is positioned to locate the device sheets just above the respective sheet holding chambers C using positioning pins 511, 512, 521. Releasing liquid flows from releasing liquid pass holes 61 into the chambers C or is drained out of the chambers C.</p> |
