| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board which has high reliability in heat-resistance and enables fine pattern formation and high-density. SOLUTION: The manufacturing method comprises: a step for preparing materials to form a first wiring layer 10 with wiring pattern and a land for a via hole on one side of an insulating substrate, to form an insulating layer 16 in the areas except for at least a part of the land for the via hole on the first wiring layer and to form a conductive layer on the other side of the insulating substrate; a step for eliminating part of the land for the via hole; a step for processing an opening for a via hole 14 in the insulating substrate under the land for the via hole so that the conductive layer is arranged at bottom; a step for forming protective materials on the other side of the insulating substrate in the conductive layer; a step for plating inside the opening for the via hole with regarding the conductive layer as an electrode, a process eliminating the protective materials; and a step for forming a second wiring layer 11 by patterning the conductive layer. |
