SEMICONDUCTOR WAFER HAVING TEST PATTERN, METHOD FOR INSPECTING SEMICONDUCTOR WAFER, METHOD FOR MANAGING MANUFACTURING PROCESS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide a test pattern with which a circuit pattern can be inspected for defects with high sensitivity in a semiconductor manufacturing process, a method for detecting defect, and a method for managing manufacturing process both of which use the test pattern. SOLUTION: The variation of the misalignment amounts of an interlayer pattern is monitored from the occurring amounts of defects in the misalignment amounts of a plurality of test patterns having different misalignment amounts. Alternatively, defects such as short circuits, continuity defects, short circuits caused by foreign matters, etc., are detected by forming test patterns having different circuit patterns.