发明名称 |
SUBSTRATE PROCESSING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of efficiently preheating a wafer during loading of the wafer to a susceptor. SOLUTION: A single-wafer CVD apparatus 10 comprises a susceptor 40 for holding a wafer 1, a heating unit 27 that is positioned underneath the susceptor 40 and that heats the wafer 1 held on the susceptor 40, and a wafer elevator 50 that lifts up and down the wafer 1 placed on central part of the susceptor 40 against peripheral part of the susceptor 40 in a process chamber 11, wherein the heating unit 27 is brought close to the wafer 1 and to the susceptor 40 when the wafer elevator 50 lifts up the wafer 1 against the susceptor 40.
|
申请公布号 |
JP2002043302(A) |
申请公布日期 |
2002.02.08 |
申请号 |
JP20000225402 |
申请日期 |
2000.07.26 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
NISHIWAKI TOMOKO;KASATSUGU KATSUNAO |
分类号 |
C23C16/46;H01L21/31;H01L21/316;(IPC1-7):H01L21/31 |
主分类号 |
C23C16/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|