发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus capable of efficiently preheating a wafer during loading of the wafer to a susceptor. SOLUTION: A single-wafer CVD apparatus 10 comprises a susceptor 40 for holding a wafer 1, a heating unit 27 that is positioned underneath the susceptor 40 and that heats the wafer 1 held on the susceptor 40, and a wafer elevator 50 that lifts up and down the wafer 1 placed on central part of the susceptor 40 against peripheral part of the susceptor 40 in a process chamber 11, wherein the heating unit 27 is brought close to the wafer 1 and to the susceptor 40 when the wafer elevator 50 lifts up the wafer 1 against the susceptor 40.
申请公布号 JP2002043302(A) 申请公布日期 2002.02.08
申请号 JP20000225402 申请日期 2000.07.26
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NISHIWAKI TOMOKO;KASATSUGU KATSUNAO
分类号 C23C16/46;H01L21/31;H01L21/316;(IPC1-7):H01L21/31 主分类号 C23C16/46
代理机构 代理人
主权项
地址