| 摘要 |
PROBLEM TO BE SOLVED: To provide a film sticking method and a film sticking device for minimizing a gap generated between an anisotropic conductive film(ACF) and a substrate in the case of sticking an IC chip to a substrate by using the ACF. SOLUTION: Air inside the ACF 5 and a recessed part 4 in a grid shape surrounded by a land (electrode) 2 and resist 3 formed on the substrate is gradually pressurized after bringing it into point contact or line contact at the time of starting pressurization, and is discharged to the outside of a grid edge, and the gap of a sticking part is eliminated.
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