| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC socket capable of coping with high frequency by shortening the length of a wire between an IC lead and an electrode pad and lowering self-inductance, and improving the contact performance between a contact pin and the electrode pad. SOLUTION: This IC socket has a socket body 1 for packaging on a test board having an electrode pad, where an IC package positioning part 3 is formed at the center thereof, plural contact pins 8 arranged in a straight line in a pin positioning groove 4 of the socket body 1, a pin positioning rod 5 disposed corresponding to the peripheral part of the socket body 1 for positioning the center of the plural contact pins 8, an elastic body A 6 disposed between the peripheral part of the socket body 1 and the pin positioning rod 5 for pressing against the plural contact pins 8 to the electrode pad 9 of the test board 10, and an elastic body B 7, capable of restoring deformation of the plural contact pin 8.
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