| 摘要 |
PROBLEM TO BE SOLVED: To prevent bending on an insulating resin layer caused by pressure during flip-chip mounting of an LSI chip on a built-up printed wiring board. SOLUTION: In a flip-chip mounting structure of an LSI chip that an LSI chip having a predetermined number of projecting electrodes is mounted on a printed wiring board by applying weight, the printed wiring board has a characteristics that an electrode pad of the printed wiring board that corresponds to the position of the projecting electrode is formed by a via hole. Using the printed wiring board improves reliability in electrical connections because the electrode pad and the projecting electrode are connected by not only one point as before but by a predetermined side of a bump. At the same time, using the printed wiring board prevents the outermost layer from bending and also prevents the via hole 30A as the electrode pad from sinking because the pressure disperses to each connection side, which prevents the pressure applied on the edge of the pad.
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