SEMICONDUCTOR LIGHT EMITTING ELEMENT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve the problem that the periphery of two LED chips must be enclosed by a scattering material when they are mounted side by side on the same plane and a mixed color is obtained by causing them to emit light simultaneously. SOLUTION: An LED chip 20 emitting light of short wavelength is stacked on the upper surface of an LED chip 10 emitting light of long wavelength. N type electrodes 18, 25 of the long wavelength LED chip 10 and the short wavelength LED chip 20, and the lead out electrode 16 of the long wavelength LED chip 10 and a P type electrode 24 of the short wavelength LED chip 20 are bonded, respectively, by flip-chip bonding.