| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for filling metal into a through hole in a ceramic substrate, which allows the through hole filled by the metal to excel in hermeticity and chemical resistance when the metal is filled into the through hole formed in the ceramic substrate after calcination. SOLUTION: The method for filling the metal into the through hole in the ceramic substrate comprises: a step 1, where past 3, which includes alloy powder 1 including at least any of Ti, Zr, and Hf of group IV active metal, is filled into a through hole 5 formed in a ceramic substrate 4 after calicination; a step 2, where the alloy powder 1 in the through hole 5 is melted by heating; and a step 3, where the metal in the through hole is solidified by cooling.
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