| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device which can resin-seal one side of a molded product reliably without generating resin burrs. SOLUTION: In this method of manufacturing a semiconductor device, a substrate on which a plurality of semiconductor chips and/or circuit components are mounted on one side thereof is molded. This molded article is clamped by an upper mold 20 and a lower mold 21 to resin-seal the one side, on which semiconductor chips, etc., are mounted. A mold is used wherein cavity depressed portions 26a are partitioned and formed individually in one mold surface of the upper mold or lower mold for resin-sealing the molded article 16, by partitioning portions corresponding to each resin-sealed regions. A release film 40 for stripping the mold and a sealing resin easily is provided on the surface of the other mold over a range covering a flat surface region of the molded article. The molded article 16 is placed in the mold and clamped via the release film. A resin is filled in each cavity formed by pressing and contacting an end surface of the partitioning portions on a surface of the substrate via the release film to resin-seal the substrate.
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