发明名称 METHOD AND DEVICE FOR FORMING PROTECTIVE COATING FILM FOR DIODE ELEMENT
摘要 PROBLEM TO BE SOLVED: To solve a problem that, when a liquid protective substance on the outer peripheral surface of a roller is transferred to a diode chip, the amount of the transferred substance varies. SOLUTION: A diode element 1 is transported to under a roller 11 to which a liquid protective substance 17 is attached by using comb-like objects 6, 7. There are provided with guides 9, 10 having a circular top surface 9a, 10a and a lead pressing body 13. When the diode element 1 is transported to under the roller, a lead 3 is sandwiched between the guide 9 and the lead pressing body 13 to stop the rotation of the diode element 1. In this state, the liquid protective substance 17 is attached to a diode chip 2.
申请公布号 JP2002043341(A) 申请公布日期 2002.02.08
申请号 JP20000225629 申请日期 2000.07.26
申请人 SANKEN ELECTRIC CO LTD 发明人 MATSUBARA HIDEYUKI
分类号 H01L21/56;H01L29/861;(IPC1-7):H01L21/56 主分类号 H01L21/56
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