SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a small-sized semiconductor device improving heat dissipating characteristics. SOLUTION: A composite material 10 is constituted so as to surround the outer periphery of a structural material 14 comprising a material of high heat conductivity by a frame body 12 comprising the material of a small expansion coefficient. A silicon chip 20 constituting a power circuit is mounted on the composite material 10, and a heat dissipating body 16 is attached to the composite material 10.