| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device that can incorporate easily chip address data being intrinsic for a chip without providing chip selecting signal terminal having the same numbers as the number of chips, reduces the chip area, miniaturizes the chip size, shortens the manufacturing period, and reduces the manufacturing cost. SOLUTION: A chip address being intrinsic for a semiconductor memory chip is formed by varying wire bonding connection of an external terminal 21 and either of pads 31a, 31b of a pair of address input pad, and wire bonding connection of an external terminal 28 and either of pads 38a, 38b of a pair of address input pad, for each semiconductor memory chip, and a chip selecting signal CEi for chip active is outputted to select a semiconductor memory chip in which this chip address coincides with address signals A1-A8 inputted from each external terminal 21-28.
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