发明名称 |
ELECTRONIC COMPONENT WITH METALLIC LID |
摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component with a metallic lid which can improve sealing performance of a housing-type case by using a metallic lid. SOLUTION: This electronic component with the metallic lid has a housing- type case 1 of which the upper side has an opening, containing an electronic component A interiorly, and a metallic lid 31 which covers the opening of the housing-type case 1 to seal the case 1 with an adhesive. The central area of the metallic lid 31 has easily deformable area 32 which can be deformed more easily than the remaining area of the lid 31.
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申请公布号 |
JP2002043769(A) |
申请公布日期 |
2002.02.08 |
申请号 |
JP20000230907 |
申请日期 |
2000.07.31 |
申请人 |
KYOCERA CORP |
发明人 |
MURAHASHI MASATO;MAENO TAKANORI |
分类号 |
H05K5/03;H01L23/02;H01L23/12;H05K5/06;(IPC1-7):H05K5/03 |
主分类号 |
H05K5/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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