发明名称 ELECTRONIC COMPONENT WITH METALLIC LID
摘要 PROBLEM TO BE SOLVED: To provide an electronic component with a metallic lid which can improve sealing performance of a housing-type case by using a metallic lid. SOLUTION: This electronic component with the metallic lid has a housing- type case 1 of which the upper side has an opening, containing an electronic component A interiorly, and a metallic lid 31 which covers the opening of the housing-type case 1 to seal the case 1 with an adhesive. The central area of the metallic lid 31 has easily deformable area 32 which can be deformed more easily than the remaining area of the lid 31.
申请公布号 JP2002043769(A) 申请公布日期 2002.02.08
申请号 JP20000230907 申请日期 2000.07.31
申请人 KYOCERA CORP 发明人 MURAHASHI MASATO;MAENO TAKANORI
分类号 H05K5/03;H01L23/02;H01L23/12;H05K5/06;(IPC1-7):H05K5/03 主分类号 H05K5/03
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