| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an exceptional multiwire wiring board to realize a uniform thickness between layers of electric insulated wires or of an inner layer circuit and an electric insulated wire, and a multiwire wiring board manufactured by its manufacturing method. SOLUTION: In a manufacturing method of a multiwire wiring board to form an adhesive layer on an insulating board or an inner layer circuit board overlapped by pre-preg larger than an outside shape of the multiwire wiring board in size, to activate the adhesive layer adding to supersonic vibration over the electric insulated wire and to fix the electric insulated wire in required shape, a manufacturing method of the multiwire wiring board, having a process to lay the electric insulated wire which is not used as a circuit on areas except for the areas so that the electric insulated wire used as a circuit is going to be laid, is provided in the invention. |
