ELECTRONIC ELEMENT ASSEMBLY

摘要

PROBLEM TO BE SOLVED: To make an electronic element assembly compact as much as possible without producing a heat dissipating problem generated by an electronic element by improving the electronic element of type having electromagnetic shielding. SOLUTION: In the electronic element assembly of type arranging the electronic element in the inside of the electromagnetic shielding, the electronic element 6 is thermally conducted and coupled to the electromagnetic shielding 5 by a heat conduction body 7 mounted on the electronic element.