| 摘要 |
PROBLEM TO BE SOLVED: To carry out step measurement of a wafer, etc., under optimized conditions for obtaining correction information wherein a step of a wafer, etc., which is necessary during exposure, is corrected. SOLUTION: A plurality of parameters which are necessary for step measurement are defined in advance to a wafer whose surface condition shifts one after another passing through each process, and in steps S1 and S2, for example, it is judged whether step measurement is necessary or not to a set wafer by a parameter. In a step S4, the place of measurement shot for carrying out step measurement is judged. In a step S7, and a step S9, measurement shot is scanned and step measurement is carried out, thus obtaining correction information. |
