发明名称 SEMICONDUCTOR SUBSTRATE, FIELD EFFECT TRANSISTOR, METHOD OF FORMING SiGe LAYER AND METHOD OF FORMING STRAINED Si LAYER USING SAME, AND METHOD OF MANUFACTURING FIELD EFFECT TRANSISTOR
摘要 PURPOSE: A semiconductor substrate, a field effect transistor, a method of forming a SiGe layer and a method of forming a strained Si layer using the same, and a method of manufacturing a field effect transistor are provided to reduce the threading dislocation density of the SiGe layer and to minimize the surface roughness. CONSTITUTION: On top of a Si substrate(1) is provided a SiGe buffer layer(2) constructed of a plurality of laminated layers having alternating layers of a SiGe gradient composition layer in which the Ge composition ratio increases gradually from the Ge composition ratio of the base material, and a SiGe constant composition layer which is provided on top of the gradient composition layer and in which the Ge composition ratio is equal to that of the upper surface of the gradient composition layer.
申请公布号 KR20020011338(A) 申请公布日期 2002.02.08
申请号 KR20010046230 申请日期 2001.07.31
申请人 MITSUBISHI MATERIALS CORPORATION;MITSUBISHI MATERIALS SILICON CORPORATION 发明人 MIZUSHIMA KAZUKI;SHIONO ICHIRO;YAMAGUCHI KENJI
分类号 H01L29/78;H01L21/20;H01L21/205;H01L21/335;H01L21/337;H01L21/338;H01L29/10;H01L29/778;H01L29/812;H01L31/04;(IPC1-7):H01L21/335 主分类号 H01L29/78
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