| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide structure for disposing lands of a circuit board to allow closely packed disposition of lands. SOLUTION: The structure for disposing lands has possible points of disposing lands in multiple rows and columns at the minimum intervals p on a surface of a circuit board. Points selected from the possible points provide the lands 1, 2 as contracts. Traces 11, 12 connected to pads 1, 2 are located in areas without lands. All the possible points in the first row have the lands 1. The areas without pads are formed and extended in the direction of columns in the predetermined columns from the second column on. The traces 11 are provided in the areas without lands.</p> |
