摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board that can efficiently remove an unnecessary portion and the like of the printed wiring board where electronic parts are mounted. SOLUTION: The manufacturing method comprises: a step such that a hole 4 for a normal through hole, a breakage with a smaller diameter than the hole 4 and a small hole 5 f or a through hole for setting a mounting position of an electronic parts are simultaneously drilled at a predetermined position on the printed wiring board 1; a step such that a through hole plating treatment is executed on the printed wiring board 1 that two holes 4, 5 for a through holes of different diameter and size are drilled; and a step such that the breakage with a small diameter, the small hole 5a on the printed wiring board 1 being subjected to the through hole plating treatment are drilled again to almost the same size of diameter with a hole 4a for the normal plated through hole being subjected to the plating treatment, and a hole 5b for un-plated through hole is drilled.
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