| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that abnormal discharge is generated between a lower electrode 2 and a part such as a focus ring 2A by generating a potential difference between the lower electrode 2 and the focus ring 2A by the voltage drop of the lower electrode 2 because a detection circuit 8 functions as a discharge circuit while performing plasma processing on a semiconductor wafer in the case of a mechanism for mounting a work to be processed of a separation type as shown in Figure 5, for instance. SOLUTION: The mounting mechanism 10 is provided with an electrostatic chuck 11 as shown in Figure 1, for instance, the lower electrode 12 supporting the electrostatic chuck 11 and comprising aluminum in alumite process, a high frequency power source 14 applying high frequency electric power through a matching circuit 13 on the lower electrode 12, a high voltage power source 16 applying direct current voltage on the electrode plate 11A of the inside of the electrostatic chuck 11, and a detection circuit 18 detecting bias voltage Vdc of the lower electrode 12. A relay switch 18D is provided on the detection circuit 18.</p> |
