| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the defect of a conventional semiconductor device such as that a thin module such as an IC card or the like is very weak for bending or a warp since it is thin, and that it takes material cost since it adopts a supporting board, which leads to cost up. SOLUTION: A semiconductor IC chip 24 has a plurality of packages 28A-28C which are sealed with first insulating resin 21, and a coupling piece 23A which couples each package, being buried in the above plural packages 28A-28C, and the above coupling piece 23A is turned, and the above plural packages 28A-28C are sealed in piles with second insulating resin 22. A semiconductor device 20 can bear a thickness, and the strength to bending or a warp rises.</p> |
