SOLDER BUMP FORMATION DEVICE, SOLDER BUMP FORMATION METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR THEREBY

摘要

PROBLEM TO BE SOLVED: To provide a solder bump formation device capable of stably discharging fused solder. SOLUTION: In this solder bump formation device provided with a nozzle and a fused solder chamber for housing the fused solder for discharging the fused solder from the nozzle and forming a solder bump, the nozzle is provided with a straight part and a tapered part widened on the side of the fused solder chamber. The liquid level of the fused solder before discharge is stopped at the boundary of the tapered part and straight part of the nozzle.