| 摘要 |
PROBLEM TO BE SOLVED: To efficiently inspect the coupled states of leads and silicon chips with bonding pads. SOLUTION: By utilizing the light transmissivity of a carrier film 2, the coupled states of the leads 76 and silicon chips 78 with the bonding pads 80 are inspected by means of a camera 32 for inspection, based on the optical images of the pads 80 transmitted through the film 2. Since no complicated inspection step is required for removing the coupled silicon chips 78, the inspections can be executed efficiently. |
