Elektronisches Bauteil mit einer Vielzahl von Kontakthöckern

摘要

The invention relates to an electronic device having a multiplicity of contact bumps and an intermediate support. In this case, the intermediate support connects the multiplicity of contact bumps to contact areas of a semiconductor chip via a multiplicity of flat conductors which have contact connecting lugs exposed in a bonding channel window of the intermediate support. The contact areas are configured in the bonding channel window via the bonded contact connecting lugs of the flat conductors. The width of the bonding channel window is increasingly greater with increasing distance from the neutral point of the semiconductor chip.