| 摘要 |
A method for controlling wafer uniformity in a polishing tool (20) includes providing a plurality of carrier heads (40), determining a signature for each of the carrier heads (40), and installing carrier heads (40) with similar signatures in a polishing tool. A processing line includes a polishing tool (20) and a processing tool (120). The polishing tool (20) is adapted to polish wafers. The polishing tool (20) includes a plurality of carrier heads (40), each carrier head (40) having a polishing signature similar to the other carrier heads (40). The processing tool (20) is adapted to process the polished wafers in accordance with a recipe. At least one parameter in the recipe is based on the polishing signatures of the carrier heads (40). |
