发明名称 |
CHIP SCALE SURFACE MOUNTED DEVICE AND PROCESS OF MANUFACTURE |
摘要 |
<p>A chip scale package has a MOSFET die (30) which has a top electrode surface (37) covered with a layer of a photosensitive liquid epoxy (111) photolithographically patterned to expose portions of the electrode (37), and to act as a passivation layer or solder mask. A solderable contact layer (40) is formed over the remaining portions of the layer of liquid epoxy (111). Each individual die (30) is mounted drain side down in a metal clip (100) or is mounted drain side down in a can with a drain electrode (34) disposed coplanar with a flange (105) extending from the can bottom (101).</p> |
申请公布号 |
WO0175961(A8) |
申请公布日期 |
2002.02.07 |
申请号 |
WO2001US10074 |
申请日期 |
2001.03.29 |
申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
STANDING, MARTIN;SCHOFIELD, HAZEL, DEBORAH |
分类号 |
H01L21/52;H01L21/60;H01L23/12;H01L23/31;H01L23/40;H01L23/492;H01L23/544;(IPC1-7):H01L21/476;H01L29/40;H01L23/52;H01L23/48 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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