发明名称 |
High performance thermal/mechanical interface for fixed-gap references for high heat flux and power semiconductor applications |
摘要 |
? A thermal mechanical interface usable between a heatsink and a heat dissipating device is disclosed. In one embodiment, the thermal mechanical interface comprises a thermally conductive mechanically resilient member having a corrugated cross section and a first thermal conductance, disposed between the heat sink and the heat dissipating device and a thermal interface material having a second thermal conductance, disposed within the corrugated cross section.
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申请公布号 |
US2002015288(A1) |
申请公布日期 |
2002.02.07 |
申请号 |
US20010910524 |
申请日期 |
2001.07.20 |
申请人 |
DIBENE JOSEPH T.;HARTKE DAVID H.;JOHNSON WENDELL C.;RAISZADEH FARHAD;DERIAN EDWARD J.;SAN ANDRES JOSE B. |
发明人 |
DIBENE JOSEPH T.;HARTKE DAVID H.;JOHNSON WENDELL C.;RAISZADEH FARHAD;DERIAN EDWARD J.;SAN ANDRES JOSE B. |
分类号 |
G06F1/18;H01L23/427;H01L23/433;H01R12/16;H05K1/02;H05K3/36;(IPC1-7):H05K7/20 |
主分类号 |
G06F1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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