发明名称 Method and apparatus for forming deposited film
摘要 A method for forming a deposited film, comprising generating plasma in a plurality of successive vacuum containers and continuously forming a deposited film on a belt-like substrate while continuously moving the substrate in its longitudinal direction, wherein an opening of a discharge container is adjusted with an opening adjusting plate having a shape set so as to reduce ununiformity of a deposited film thickness in a width direction of the substrate on the basis of a measurement of a deposition rate distribution. Accordingly, there is provided a method and an apparatus for forming a deposited film which are capable of producing a photovoltaic element without ununiformity in characteristics by depositing semiconductor layers without ununiformity in thickness and quality.
申请公布号 US2002015802(A1) 申请公布日期 2002.02.07
申请号 US20010800724 申请日期 2001.03.08
申请人 OZAKI HIROYUKI;KANAI MASAHIRO;OKADA NAOTO;MORIYAMA KOICHIRO;SHIMODA HIROSHI 发明人 OZAKI HIROYUKI;KANAI MASAHIRO;OKADA NAOTO;MORIYAMA KOICHIRO;SHIMODA HIROSHI
分类号 C23C16/50;C23C16/511;C23C16/52;C23C16/54;H05H1/24;(IPC1-7):C23C16/00 主分类号 C23C16/50
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