发明名称 THERMOPLASTIC MATERIALS WITH IMPROVED THERMAL CONDUCTIVITY AND METHODS FOR MAKING THE SAME
摘要 <p>Thermally conductive polymeric materials, compositions and methods of making are provided. The materials include relatively high concentrations of thermally conductive filler materials, preferably fibrous filler materials. The compositions may be used is a variety of applications to form molded and extruded articles.</p>
申请公布号 WO2002009939(A1) 申请公布日期 2002.02.07
申请号 US2001023652 申请日期 2001.07.27
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