Wire-saw for cutting semiconductor wafers from single-crystal workpieces, includes supply device for supplying compensating sawing wire to wire guide rollers

摘要

A wire-saw for severing a number of discs or wafers from a workpiece i.e. a single crystal and comprises a saw-wire of a finite length with bonded cutting grain, and in which the part of the cutting wire wound around the wire guide rollers is significantly longer than the reserve of wire of the supply device.