发明名称 |
Terminal electrode forming method in chip-style electronic component and apparatus therefor |
摘要 |
The invention provides an electrode forming method with steps of arraying chip-style electronic components on an arraying flat bed thereby positioning and aligning the components, lowering a film coated with an adhesive in relative manner together with an adhering top plate parallel to the arraying flat bed thereby adhering ends of the positioned and aligned chip-style electronic components to the adhesive, then lowering the first film to which the chip-style electronic components are adhered in relative manner together with a coating top plate parallel to a coating flat bed provided with a conductive paste layer of a constant thickness thereby pressing the other ends of the chip-style electronic components to the coating flat bed and coating the ends of the electronic components with the conductive paste.
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申请公布号 |
US2002014202(A1) |
申请公布日期 |
2002.02.07 |
申请号 |
US20010820846 |
申请日期 |
2001.03.30 |
申请人 |
TDK CORPORATION |
发明人 |
ONODERA KO;KURIMOTO SATOSHI |
分类号 |
H01L23/48;H01G13/00;(IPC1-7):B05C3/02 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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