发明名称 |
Connecting method and connecting structure of printed circuit boards |
摘要 |
Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.
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申请公布号 |
US2002014518(A1) |
申请公布日期 |
2002.02.07 |
申请号 |
US20010907599 |
申请日期 |
2001.07.19 |
申请人 |
TOTANI MAKOTO;MIYAKE TOSHIHIRO;YOKOCHI TOMOHIRO;TERAMAE TAKEHITO;YAZAKI YOSHITARO;DEGUCHI KAZUYUKI;NAKAGAWA HAJIME |
发明人 |
TOTANI MAKOTO;MIYAKE TOSHIHIRO;YOKOCHI TOMOHIRO;TERAMAE TAKEHITO;YAZAKI YOSHITARO;DEGUCHI KAZUYUKI;NAKAGAWA HAJIME |
分类号 |
H01R12/62;H05K3/34;H05K3/36;(IPC1-7):B23K31/02 |
主分类号 |
H01R12/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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