发明名称 Wire bonding apparatus
摘要 There is provided a wire bonding apparatus operated steadily at a high speed without excitation of vibrations of an XY stage 102 and a capillary 104, which are movable parts. The wire bonding apparatus is configured so as to have a composite target path generating section 208 for generating a target path 109, in which the deceleration part of a go path and the acceleration part of a return path are composed to one continuous path, for a path part of reciprocating movement of said target path indicating a motion process of either one or both of the XY stage and capillary. Therefore, the period of a composite target acceleration path can be set long while the required time until the end of path is shortened, and the wire bonding apparatus can be operated steadily at a high speed without excitation of vibrations of the XY stage and capillary, which are movable parts.
申请公布号 US2002014512(A1) 申请公布日期 2002.02.07
申请号 US20010919860 申请日期 2001.08.02
申请人 NEC CORPORATION 发明人 TODA YASUSHI
分类号 H01L21/60;B23K20/00;H01L21/00;(IPC1-7):B23K31/02;B23K37/00 主分类号 H01L21/60
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