VAPOR CHAMBER WITH INTEGRATED PIN ARRAY

摘要

A heat transfer device wherein a vapor chamber is combined with a pin structure that allows the highly conductive cooling vapors to flow within the pins of a pin array maximizing the efficiency of both components of the heat sink into one unit is disclosed. In one embodiment the heat transfer device comprises a thermally conductive chamber having a first thermally conductive chamber portion having a base thermally coupleable to a heat dissipating device; a second thermally conductive chamber portion having a plurality of hollow protrusions extending away from and in fluid communication with the first thermally conductive chamber portion wherein the thermally conductive chamber comprises a fluid vaporizable when in thermal communication with the heat dissipating device and condensable when in thermal communication with the hollow protrusions.