发明名称 Abrasive molding and abrasive disc provided with same
摘要 An abrasive molding consisting essentially of inorganic particles having an average particle diameter in the range of 0.005 mum to 0.3 mum, and having a relative density in the range of 45% to 90%, provided that pores having a diameter of at least 0.5 mum are excluded from the molding. The abrasive molding is used for polishing a material to be polished by using a polishing liquid, preferably water or an aqueous solution of an alkali metal hydroxide, which does not contain a loose abrasive grain.
申请公布号 US2002014309(A1) 申请公布日期 2002.02.07
申请号 US20010895391 申请日期 2001.07.02
申请人 TAKATOH SHUJI;HONMA YOKO;ASANO MUTSUMI 发明人 TAKATOH SHUJI;HONMA YOKO;ASANO MUTSUMI
分类号 B24D3/04;B24B37/04;B24B37/12;B24D3/00;B24D7/02;B24D18/00;(IPC1-7):C23F1/02;B24B5/00 主分类号 B24D3/04
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