发明名称 |
Abrasive molding and abrasive disc provided with same |
摘要 |
An abrasive molding consisting essentially of inorganic particles having an average particle diameter in the range of 0.005 mum to 0.3 mum, and having a relative density in the range of 45% to 90%, provided that pores having a diameter of at least 0.5 mum are excluded from the molding. The abrasive molding is used for polishing a material to be polished by using a polishing liquid, preferably water or an aqueous solution of an alkali metal hydroxide, which does not contain a loose abrasive grain. |
申请公布号 |
US2002014309(A1) |
申请公布日期 |
2002.02.07 |
申请号 |
US20010895391 |
申请日期 |
2001.07.02 |
申请人 |
TAKATOH SHUJI;HONMA YOKO;ASANO MUTSUMI |
发明人 |
TAKATOH SHUJI;HONMA YOKO;ASANO MUTSUMI |
分类号 |
B24D3/04;B24B37/04;B24B37/12;B24D3/00;B24D7/02;B24D18/00;(IPC1-7):C23F1/02;B24B5/00 |
主分类号 |
B24D3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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