| 摘要 |
A motherboard is provided with a through-hole in a region thereof on which a module is mounted in contact with the motherboard. Heat, generated when heating the motherboard and the module so as to connect with each other by soldering, can quickly dissipate, in a cooling process, through the through-hole from a substrate of the module in which the heat is likely to accumulate, whereby unevenness of temperature distribution through the module can be suppressed. By virtue of the through-hole provided in the region of the motherboard in which the heat is likely to accumulate, the heat can also quickly dissipate from the region of the motherboard, whereby the unevenness of temperature distribution through the motherboard can be alleviated. The module and the motherboard are prevented from warping due to the unevenness of temperature distribution, whereby unstable connection is avoided.
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