发明名称 |
Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices |
摘要 |
A plurality of chips divided from a semiconductor wafer having a plurality of semiconductor integrated circuits formed on a front surface of the wafer, are prepared, front surfaces of the chips being bonded to a first wafer sheet. The back and side surfaces of each chip bonded to the first wafer sheet are covered with a reinforcing thin film. Each of the plurality of chips is removed from the first wafer sheet. The flexural strength of a chip can be suppressed from being lowered by chipping and chip cracks. |
申请公布号 |
US2002014661(A1) |
申请公布日期 |
2002.02.07 |
申请号 |
US20000735476 |
申请日期 |
2000.12.14 |
申请人 |
FUJITSU LIMITED |
发明人 |
OKAMOTO TADAHIRO;MATSUKI HIROHISA |
分类号 |
H01L21/301;H01L21/44;H01L21/46;H01L21/68;H01L21/78;H01L23/00;H01L23/31;H01L27/01;H01L27/12;H01L31/0392;(IPC1-7):H01L27/01;H01L31/039 |
主分类号 |
H01L21/301 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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