发明名称 |
METHOD AND DEVICE FOR PRODUCING CONNECTION SUBSTRATES FOR ELECTRONIC COMPONENTS |
摘要 |
According to a method for producing connection substrates for semiconductor chips, preferably PSGA (polymer stud grid array) substrates, a blank body (1), preferably a film, is heated and humps (3) and/or recesses are produced on at least one of its surfaces using an embossing roller. High temperature resistant thermoplastics, preferably LCPs (liquid crystal polymers), are used as the material for the substrate body. Their surface can preferably be provided with a metallic layer which is in turn provided with openings as an embossing aid. |
申请公布号 |
WO0211202(A2) |
申请公布日期 |
2002.02.07 |
申请号 |
WO2001DE02892 |
申请日期 |
2001.07.31 |
申请人 |
SIEMENS DEMATIC AG;THELEN, RICHARD;VAN PUYMBROECK, JOZEF |
发明人 |
THELEN, RICHARD;VAN PUYMBROECK, JOZEF |
分类号 |
H01L21/48;H01L23/13;H01L23/498;H05K1/00;H05K1/11;H05K3/00;H05K3/46 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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